研究開发
为了满足客户的需求,我们对產品不断的提高品质,并提供最好的服务。
\r\n 我们专门成立了研发团队,開发新產品,研究新的生產技术。
\r\n 我们研究及開发工作的目的是为满足客户的需求,为客户的產品提供最好的解决方案。
\r\n The Core Technology of SUNRISE is
Plastic molding
Thin wall molding injection (Current is capability is 24mmx32mmx0.12mm)
Plane plastic molding injection (For IC packing tray(322.6mmx135.9mm , Max. warpage. controlled is 0.30mm)
Micro Parts molding injection (Current capability is 3mmx3mm +/-0.01mm)