| 1991 |
Set-up
of Company, mass-production of sports materials
and accessories
|
| |
| 1992 |
Mass production
of packing tray of QFP28x28, QFP14x20 of JEDEC specifications |
| |
| 1996 |
Mass
production of IC packing tray of MQFP14x20, BGA35x35,
BGA27x27 JEDEC SPCIFICATIONS |
| |
| 1997 |
Mass
production of IC packing tray of TQFP14x20 JEDEC
SPECIFICATIONS |
| |
| 1998 |
Mass
production of IC packing tray of TSOP TYPEI and
TYPEII JEDEC specifications |
| |
| 1999 |
Mass
production of CSP(chip scale package) IC packing
tray |
| |
| 2000 |
Received
patent Design Authorization for IC packing tray
of R.H.MURPHY BGA JEDEC specifications |
| |
| 2001 |
Mass
production of embossed carrier tape |
| |
| 2002 |
Mass
production memory card |
| |
|
